Crossover: 2014

Chapter 444 Development of Integrated Circuit Industry (continued)
"In 2013, China's integrated circuit imports were 2313 billion US dollars.

The strong domestic/domestic market demand is also a powerful motivation for developing our country's integrated circuit industry.my country has the world's largest and fastest-growing integrated circuit market, with a scale of 2013 billion yuan in 9166, accounting for about 50% of the global market share.With the transformation of my country's economic development mode, the accelerated adjustment of industrial structure, and the simultaneous development of new industrialization, informatization, urbanization, and agricultural modernization, the deep integration of industrialization and informatization, and the vigorous promotion of information consumption, the demand for integrated circuits will increase significantly. , It is estimated that the market size will reach 2015 trillion yuan by 1.2.

At present, the global integrated circuit industry has entered a period of major adjustment and transformation, which not only brings challenges to the development of my country's integrated circuit industry, but also provides a rare opportunity for catching up.In the new historical period, the "Promotion Outline", as an action plan to guide the development of China's integrated circuit industry for a period of time in the future, is of great significance to accelerate the development of the industry.

In recent years, driven by the market and supported by policies, my country's integrated circuit industry has developed rapidly and its overall strength has improved significantly.However, it cannot be ignored that the lack of core technologies restricting the expansion and strength of my country's integrated circuit industry, and the difficulty of products meeting market demand are still very prominent.

The reasons: First, the corporate financing bottleneck is prominent.Backbone enterprises have poor self-hematopoietic function, high domestic financing costs, and social capital/capital also lack the willingness to invest due to the large amount of investment in the integrated circuit industry and the relatively long return cycle.Second, the continuous innovation ability is not strong.Leading talents are scarce, and enterprises are small and weak; the R&D investment of the entire industry is less than one-sixth of that of Intel alone.The third is that industrial development is out of touch with market demand, and the synergy pattern of the "chip-software-machine-system-information service" industrial chain has not yet been formed, and the advantages of the domestic demand market cannot be fully utilized.

In addition, the imperfect policy environment that adapts to the characteristics of the industry is also an important reason for the low competitiveness of the industry.Through the implementation of the "Promotion Outline", it is necessary to solve the above problems and create a good environment for industrial development..."

"...From the perspective of the development focus of several sub-sectors, in terms of the design industry, the layout is carried out around the industrial chain, and the recent focus is on the core technologies and products of mobile intelligence and network communication to enhance the core competitiveness of the information technology industry; Key chips and software for the Internet of Things and big data, innovative business models, and seizing the commanding heights of future industrial development; by field and category, gradually breaking through core chips and software for smart grid, smart transportation, financial electronics and other industries. In terms of manufacturing, Seize the favorable opportunity of technological change, break through the bottleneck of investment and financing, accelerate the construction of advanced production lines, improve comprehensive capabilities, and establish a sustainable profit model. At the same time, take into account the development of characteristic processes. In the packaging and testing industry, improve chip-level packaging and wafer-level packaging , through-silicon vias, three-dimensional packaging and other advanced packaging and testing technology levels, and expand the scale. In terms of equipment and materials industry, strengthen the combination of equipment, materials and processes, and develop key equipment such as lithography machines, etching machines, and ion implanters. Develop key materials such as photoresist and large-size silicon wafers, and quickly form supporting capabilities."

Previously, Lin Hui did have some ideas similar to EUV lithography machines.

In fact, Lin Hui also claims to have a certain amount of drafts in terms of hardware.

However, after reading the official detailed and macroscopic data, Lin Hui suddenly discovered that his so-called belly draft was more or less a bit off. .

Although it can't be said that the idea is ridiculous, in the face of such a mature and rigorous official plan, Lin Hui's so-called belly draft is still quite immature.

Compared with Lin Hui's "belly draft" about a clear timeline, this official document has a clear timetable,

Follow the progress set out in the document
"...One is to highlight the dominant position of the enterprise in the market, making it the main body of innovation and the driving force of industrial development. The second is to highlight the layout of the entire industry chain of "chip design-chip manufacturing-packaging testing-equipment and materials" and coordinate development. Then build the "chip-software-machine-system-information service" ecological chain; starting from the global industrial development trend and domestic industrial foundation, put forward the industrial development goals in three stages of 2015, 2020 and 2030. In 2015, innovations in mechanisms and systems achieved results, and a management decision-making system, financing platform, and policy environment in line with the laws of the integrated circuit industry were established. By 2020, the gap with the international advanced level will be gradually narrowed, and a technologically advanced, safe and reliable Integrated circuit industry system. By 2030, the industry as a whole will reach the international advanced level and achieve leapfrog development.”

As a visitor from across time and space, although Lin Hui has no way of knowing exactly what will happen in 2030, the related goals that were also planned in 2015 and 2020 in the previous life were indeed implemented as planned.

Thinking of this, Lin Hui felt that the many problems faced by the hardware were actually nothing. After all, Lin Hui was not struggling alone.

Behind Lin Hui is a powerful motherland.

In addition, this incident seems to have inspired Lin Hui:

——A person's wisdom is limited after all.

Some tricky things resort to the wisdom of the crowd is the real way out.

Perhaps having a suitable opportunity to cooperate deeply with the official is the best solution to maximize the value of past life information.

(End of this chapter)