The Light of Domestic Products: The whole world begs me to sell

Chapter 208 Are you ready to start a laptop price war?

Like most technologies in this world, different technical routes can ultimately achieve the same performance.

Just like rocket boosters, if one booster is not enough, use four.

of course.

Chip stack packaging technology is not simply stacking two 28nm chips together to achieve the performance of a 14nm chip. If it is so simple, then major foundries have already applied it.

In fact, state-of-the-art chip stack packaging technology is very difficult.

Not only has the complexity of chip design increased by a hundredfold, but it also puts forward strict requirements on the power consumption and heat dissipation of the chip.

In terms of performance, the first thing to consider is how to achieve performance superposition of two stacked chips, and how to be compatible with each other in parallel to maximize performance.

In terms of design, in addition to considering how to add stacked chips on a chip as large as a fingernail, power consumption and heat dissipation must also be considered!
For example, the Huyue 280 chips have a power of 35W, and if they are simply superimposed together, they will have a power of 70W.

Generally, the CPU of a notebook computer has a power of 35W. If the power of the stacked CPU is still 70W, how to solve the heat dissipation under high power?

and so.

Stacking technology sounds like stacking two chips together, which is a simple packaging technology.

In fact, stacking technology is not only a packaging technology, but also a fusion of chip design and packaging technology. It solves various problems such as performance, power consumption, and heat dissipation while solving stacked chips.

The complexity of such a design and packaging is naturally not the same as that of a normal chip design.

but.

Such top technology is now in front of Hu Lai.

【TSS-3.5D vertical chip stack packaging technology】:
3.5D vertical chip stack packaging technology is a combination of "heterogeneous chip technology" and "3.5D vertical packaging process". Power consumption, improve chip performance purpose.

[3.5D packaging technology]: After stacking, the overall performance of the two main frequency chips can be increased by 80%, and the power consumption can be reduced by 75%.

Looking at the overview of TSS-3.5D chip stack packaging technology, Hu Lai was very happy.

Although the 3.5D stacking technology can only improve the performance of two 28nm chips stacked to 80%, and the power consumption is only reduced by 75%, Hu Lai is still satisfied!
After all, laptops are different from mobile phones, and higher power consumption is still acceptable!

Without hesitation, Hu Lai directly chose to buy [3.5D packaging technology! 】

A bright light flashed, 1000 million points were deducted, and a familiar system sound came from the ear.

"Congratulations on your successful purchase of 'TSS-3.5D Vertical Chip Stacking Packaging Technology'. If you want to use '3.5D Stacking Chip Packaging Technology', you need to redesign the special stacking chip drawing in the system!"

During the process of understanding just now, Hu Lai guessed in his heart that this would be the case.

In other words, the previous Huyue 140 chip and Huyue 280 chip are just ordinary chip designs and cannot be packaged with stacking technology.

Chips that need to use stacked packaging technology in the future will need to be specially designed again.

soon.

Hu Lai found the 28nm design chip drawings in the system and clicked to buy.

28 credits are required for 25nm integral design drawings, choose NB-Y architecture, and choose consumer-grade technology.

This consumer-grade craft cost [-] points.

When clicking Next, there is one more option here:

"Do you use TSS-3.5D vertical chip stacking packaging technology?"

"Yes!"

The screen flashed, and the chip design came to the last step: adjusting the chip performance.

This time Hu Lai has more experience. This time, the 28nm stacked chips are mainly used in computers, so the size is not so important.

Last time he knew that the larger the size of a chip, the more transistors it has, and the stronger its performance.

and so.

He deliberately quit the system and asked the technical director of the Phoenix IT computer department. He got the maximum size of the Phoenix notebook CPU that can be modified, and then entered the system to make adjustments.

The power consumption is fixed at 45W, and the chip size is adjusted to the maximum acceptable range. On the floating screen, it is obvious that the CPU performance is improving.

Finally, a 28nm stack technology chip design was successful.

Unnamed chip 1: "Using 28nm technology, NB-Y architecture chip, the default main frequency is 2.8GHZ, using a six-core six-thread processor, with a computing power of 90TOPS, a power consumption design of 45W, a maximum memory of 128GB, and an independent graphics card !"

This time the stacked chip is designed to be larger than the previous two chips, and because of the larger size, it also brings performance improvements.

In this way, using two 28nm stacked chips, the most important main frequency performance is only 140GHZ lower than that of Huyue 0.1!

If it is not rigorous, the performance of the 28nm stacked chip designed in front of us is almost the same as that of the previous Huyue 140 chip!

Hu Lai was very satisfied with the performance in front of him, the absolute value of the 1000 million points!
Not only is it worthwhile, he has realized that "3.5D vertical chip stacking packaging technology" is another technical route in the chip field!
It is no exaggeration to say that the American country has always used high-end manufacturing processes to pinch the necks of Yanguo enterprises, and now, Phoenix also has a powerful weapon in the hands of the American country's chips!
When Moore's Law will eventually come to an end, it will be difficult to break through the 3nm and 2nm chip manufacturing processes.

And Phoenix has mastered the 3.5D vertical chip stacking packaging technology!
Now the Phoenix 28nm stack chip is equipped with the future operating system, and the performance can be close to that of the 7nm chip!

It won't even be too long, after collecting enough 5000 million points to buy a 14nm lithography machine, I will use the stacked packaging technology...

At that time, Phoenix's 14nm chips could beat the 5nm chips of major chip companies!
I don't know what kind of madness the American chip companies will show after knowing that Phoenix has such a stacking technology!
Soon, Hu Lai called for Director Zhang.

In a few words, he informed Director Zhang of the principle of stacking technology, and then handed over the newly designed 28nm chip drawings and packaging technology.

"Old Zhang, this is a brand new 28nm chip design drawing, called 'Tiger Leap 280D', which uses stacking technology."

"This time, you first take the stacking technology to apply for a patent, and then go to Mr. Liang Song of SMIC in person and ask him to arrange the production capacity of 28 nanometers."

"However, you know, this chip needs to be kept strictly confidential."

Factory Manager Zhang was shocked when he heard Hu Lai's description of the stacking technology, and he naturally knew the importance of this matter.

Without delay, he said hello and left.

……

Time passed quickly, near noon, Hu Lai had already received numerous concerned calls from friends, and even the leader Gao Ming made a phone call to express condolences in person.

At this time, Hu Lai, who found a solution to the predicament, was already thinking about the next step of Phoenix's plan.

The American country's blockade of Phoenix has been put on the bright side, and the chip issue has not been reversed in the slightest.
Next, Phoenix's first task must be to collect 5000 million points to truly solve the problem of 14nm lithography machines!

Then use the 14nm lithography machine to use the stacking technology to complete the catch-up in the manufacturing process, so that Phoenix has the top chips with 3nm and 5nm performance!
Before he could figure out where to start, Mr. Rebsley, who had called once this morning, suddenly called.

As soon as he picked up the phone, Rebs on the other end said in a low tone:
"Mr. Hu, just now the Winter Alliance formed by Mir and Inet jointly issued a subsidy plan to all our mainframe computer manufacturers."

"Their subsidy plan is very obvious. Each manufacturer will provide a subsidy of 300 yuan for each model sold that will be directly deducted from next year's WIN system authorization fee."

"Our rice notebook department has also been notified that they are targeting Phoenix notebooks."

"Also, just at 12:7999 noon, the price of Hongguo's 7199 yuan BookAir, which competes with Phoenix' Starry Sky, has also been reduced through the channel. Now the price of Jingdong is only [-] yuan..."

Hu Lai was taken aback for a moment, then laughed.

This time not only Mir and Inet, but also Hongguo?

This is determined to completely block the Phoenix computer in all directions!

……

PS: Thanks to the boss Feng Yuehen in the group for rewarding 2000 coins!
(End of this chapter)