Great country technology, I have a system where hard work pays off!

“Yes, with so many shortcomings, even if they successfully achieve 3D chip stacking technology, they won't be able to threaten us.

After all, by the time they develop 3D chip stacking technology, our 14nm and 16nm process technologies will already be out.”

“Indeed, it seems that Geek Technology is no longer a threat.”

Listening to the words of the presidents present, Intel CEO Paul Otellini nodded and said:

“Geek Technology is like a giant locked in a cage. No matter how well it performs, it cannot change the fact that it is in a cage.”

After a pause, Intel CEO Paul Otellini continued:

“According to my investigation, Geek Technology won’t be able to sustain itself for more than three months with its current chip orders.

In three months, Geek Technology's chip supply will be completely cut off, and that will be the time for us to launch a major counterattack.”

“Haha, let's toast to a bright future in three months!”

“Cheers!”

The sound of clinking glasses rang out.

Half a month later, at the headquarters of Geek Technology, in the technology research and development department.

“Have the simulation results come out yet?”

Gao Nian asked Academician Ni Guangnan.

“The situation is not very optimistic.”

Academician Ni Guangnan said with a deep frown.

After more than a month of hard work, Geek Technology finally designed the Phoenix S3 mobile phone processor with a 3D chip stacking structure.

As for why it was so fast, it was naturally because the research and development of the Geek S3 mobile phone processor had been going on for more than a year.

Now it is just being converted into another 3D chip stacking structure, so the time required is naturally not as long as people imagine.

“What are the main problems we are encountering now?”

Gao Nian asked Academician Ni Guangnan while picking up the report and looking at it.

“The first major problem is heat dissipation. After our analysis, we found that the current heat dissipation technology for mobile phones is completely unable to handle the Phoenix S3 mobile phone processor.

Unless we reduce the number of transistor layers from three to two, it may be possible to barely suppress the Phoenix S2 mobile phone processor.”

“A two-layer structure won't work. With so many transistors missing, the performance of the Geek S3 mobile phone processor won't be much stronger than the Phoenix S2 mobile phone processor.”

Gao Nian shook his head and rejected Academician Ni Guangnan's suggestion, disagreeing with downscaling the Phoenix S3 mobile phone processor.

After all, if the performance of the Phoenix S3 mobile phone processor is not much stronger than the Phoenix S2 mobile phone processor, then consumers will definitely be quite disappointed.

Moreover, Apple, Qualcomm, MediaTek, and other companies are not pushovers.

If the Phoenix S3 mobile phone processor is in a weak position, then consumers will definitely vote with their feet and buy Apple phones and phones with other mobile phone processors.

This would be very bad news for Geek Technology, as it would mean that Geek Technology would no longer be able to maintain its monopoly-level market position and earn huge profits.

“But limited by the major problem of heat dissipation technology, if we forcibly adopt a 3-layer structure, then the heat of the phone will be enough to burn your hand, and the power consumption will be quite alarming.”

Academician Ni Guangnan said with a frown.

Academician Ni Guangnan naturally knew what a two-layer structure represented, but if a 3-layer structure was used, then the heat generation would indeed be a major problem.

“If the current heat dissipation technology cannot solve it, then develop new heat dissipation technology.”

When Gao Nian said this, his mind recalled Huawei mobile phones from his previous life.

Speaking of which, Huawei Technology in his previous life was placed on the Entity List and could not find TSMC to代工晶片.

The only thing they could do was find domestic chip foundries to代工晶片 for them, so they chose SMIC.

However, SMIC could only mass-produce 14nm process chips at that time, so they also embarked on the same 3D chip stacking technology path as Geek Technology.

Now Geek Technology also has to take the 3D chip stacking technology path, although the process technology is not the same, one is 14nm and the other is 40nm.

But the two do have common ground, and Geek Technology can naturally draw on the experience of Huawei mobile phones in its previous life. So, as Gao Nian closed his eyes, his mind began to try to recall the bits and pieces of news he had seen in his previous life.

Among them, graphene naturally appeared in Gao Nian's mind.

After all, it is said that Huawei mobile phones in his previous life used a lot of graphene as a thermal conductive material in their mobile phone processors.

Of course, there are also flip-chip packaging technology, double-sided heat dissipation technology, microchannel liquid cooling technology,

Intelligent heat dissipation management system, and so on.

Through the nouns flashing in his mind, with Gao Nian's current technical strength, he can also guess the general principles of those technologies through technical nouns.

With the principles, everything is easy to say. The most fearful thing about research and development is not knowing which path is correct.

It can be said that under normal circumstances, in many technology research and development routes, most of them will be in vain, and only one or two technology routes are feasible.

Now that Huawei Technology in its previous life has paved a proven path, Geek Technology can naturally avoid taking the wrong path again and directly take the proven path.

This will undoubtedly greatly save research and development funds and time, so Gao Nian began to propose various heat dissipation technologies, and also raised the issue of using graphene as a heat dissipation material.

“Although graphene has very good performance, its price is too expensive, more precious than gold.

If we use it as a heat dissipation material, the cost will be too high.”

Ni Guangnan immediately shook his head and did not approve of Gao Nian's proposal.

After all, although graphene has amazing thermal conductivity, the problem is that the prices of these two things are really too expensive.

The current production of graphene can only be used in laboratories. It is simply a joke to want to use it on a large scale on chips.

Moreover, the current graphene has the problem of too low purity,

The effective graphene component in that lump of black carbon is not high, which also means that its heat dissipation performance is not as good as imagined.

Under such circumstances, if it is not high-purity graphene, the actual effect is not as good as using metal materials with stronger thermal conductivity.

“Leave the problem of graphene to me, and I will do my best to solve the problem of graphene.”

Gao Nian said with a headache.

If you want to solve the problem of excessive chip temperature, only materials with ultra-high thermal conductivity like graphene are possible.

Moreover, after solving how to purify graphene, the future prospects are also quite broad.

After all, it is not only chips that need excellent thermal conductive materials, and many things need such excellent thermal conductive materials.

In addition, with low-cost, high-purity graphene, it may not be possible to develop graphene chips in the future.