There are several very headache problems. After studying for a few days, I feel that some of the logic cannot be figured out, so I can only ask expert readers.

1. The production capacity of single crystal silicon rods: The processing time of a 12-inch single crystal rod with a length of 1.5 meters is about 100 hours. What is the approximate amount, if there is no loss, it can actually pull 6 meters of single crystal silicon.

The time required is about 400 hours, excluding the shutdown, cleaning and other work, 600 hours, about 25 days.

The thickness of an inch wafer is about 0.775 mm at the beginning, and after processing, it will be thinned to 190 microns or even 150 microns.

What is the diameter of this gold steel wire?

0.1mm? Is it so thin that it doesn't break easily?

That is to say, the initial thickness required for a wafer is = 0.775 (wafer initial thickness) + 0.1 (diamond wire diameter) = 0.885 mm

With a 6-meter-long monocrystalline silicon rod, you can calculate how many wafers can be cut out.

About 6,000 pieces if it's not cut pieces?

This data feels a bit exaggerated.

So, how much does a 6-meter-long monocrystalline silicon cost?

How much does it cost to sell to a chip maker?

Can a single crystal furnace with a power of 10MW be satisfied?

It is often heard that the construction of 1GW monocrystalline silicon wafer production capacity generally requires 100 monocrystalline furnaces with a power of 10MW.

Generally, the monocrystalline silicon factory is 20GW, that is, 2000 monocrystalline furnaces?

2000 single crystal silicon rods per month?

12 million wafers?

This data logic is not normal.

Mainly because of this logical problem.

A typical wafer fab has a monthly production capacity of tens of thousands of wafers, because processing wafers is too time-consuming, such as grinding too time-consuming, and it is easy to break.

Of course, wafer processing and the production of monocrystalline silicon rods are two different things.

Ask: Is the production of single crystal silicon rods and wafer processing the same factory?

2 The shipment rate of wafers.

The surface area of ​​a 12-inch wafer is about 70,659 square millimeters. It is said that the shipment rate is about 65%. Taking Huawei Kirin 9905G as an example, its chip area is 113.31 square millimeters (as many as 10.3 billion transistors are integrated in this place). ), which is considered a yield rate, about 300 chips can be shipped.

The monthly production of 50,000 chips is 15 million chips, which can meet the needs of 15 million mobile phones?

Recently, the knowledge of monocrystalline silicon, wafer and chip processing is very swollen, and it is too troublesome to settle accounts.

Maybe write it casually, and most readers can't find any mistakes, but I still don't want to be too casual, some things must be rigorous, and I hope to give some pointers to understand.

thanks

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